Package Design

Produtos.

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Package Design

Ferramentas de desenvolvimento e simulação para IC Package (SiP) integrando múltiplos chips em uma única plataforma de PCB. Simulação inclui análise SI/PI/EM/Thermal.

Xpedition® Package Integrator

Xpedition Package Integrator helps IC, packaging and PCB co-design teams visualize and optimize complex single or multi-chip packages integrating silicon on board platforms.

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HyperLynx DRC

HyperLynx® DRC performs PCB design rule checks for issues affecting EMI/EMC, signal integrity, and power integrity.

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HyperLynx Power Integrity

HyperLynx® PI identifies potential power integrity distribution issues that can interfere with board design logic, and investigate and validate solutions in an easy-to-use, “what-if” environment.

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HyperLynx Signal Integrity

Analyze signal integrity issues early in the design cycle to eliminate costly re-spins.

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HyperLynx 3D EM

Electromagnetic design and verification for PCB, packaging, RFIC, MMIC, and planar antenna designs.

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HyperLynx Thermal

Fast, accurate 3D modeling and simulation of thermal impact of PCB placement and routing.

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HyperLynx Analog

Full-board functional simulation with SPICE, VHDL, Verilog and other industry-standard languages.

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Nimbic - Full-wave EM Solver

3D, broadband, full-wave electromagnetic solver for SI, PI, and EMI.

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Nimbic - Accelerated Quasi-Static Extractor

Accelerated, full-3D electro-magneto-quasi-static (EMQS) extractor.

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Nimbic - Hybrid SI/PI Analysis

Accelerated system level power-aware SI extraction and power integrity analysis.

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